Overview

Currently,Titan Electronics is focused on .004"/.004" line space with .010" mechanical drill and aspect ratios or 12:1. Our operators are skilled at building double layer to 30+ layer boards with blind and buried via technology. Titan offers a wide variety of substrates and surface finishes to meet the needs of demanding high speed and high reliability applications. We offer Getek, FR406, FR4, Rogers, Polyimide, Teflon and hybrid materials. Titan offers a wide variety of surface finishes to meet requirements for Chip on Board, RoHS Compliant, Lead Free, Coplanar, Low contact resistance and Plug-In applications. Final finishes include, Immersion gold, Immersion White Tin, Immersion Silver, Hot Air Solder Level, Selective gold and both hard and soft gold body finishes.

Our advanced prototyping capabilities include .003" line and space, .006" mechanical drill, 15:1 Aspect Ratio, Stub Drilling, "Via in Pad" technology, Silver Filled Vias, and Sub 0.65mm BGA.

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